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Process Chemicals

Process Chemicals

Beside the plating equipment, MOT is able to supply specific designed plating solutions for reliable processing. In detail, we can offer:

  • micro plate Ni, a sulphamic Nickel electrolyte
  • micro plate Cu, an acidic Copper electrolyte
  • micro plate NiFe, a reliable electrolyte for the deposition of Permalloy or other Ni-Fe alloy ratios up to 55% Iron content
  • micro plate NiP, for the electrodeposition of Nickel-Phosphoer layers

For other plating solutions like NiW, Sn or other metals or alloys please feel free to contact us.

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Kontaktieren Sie unseren Fachspezialisten für eine persönliche Beratung:

Oder bestellen Sie Informationsmaterial und Angebote zu unserem Mikromaterialbearbeitung im Labor